Semiconductor Surface Modification with µAM

-
Location of 2D/2.5D features as little as 200 nm in height
-
3D printing metal microconnectors between contact pads and traces with <1 µm precision
-
3D printing metal 3D microstructures and 2D lines
-
Local dispensing of isolation or conductive layers
-
Modification of the surface with novel materials
Explore more micro AM use cases: Fundamental Research
Discover the myriad of research possibilities using CERES