Semiconductor Surface Modification with µAM

Additive micromanufacturing provides new possibilities to support traditional lithographic processes for research and industrial applications. It has the capacity to modify lines and traces and chip surfaces very locally, and with pinpoint accuracy. 

The CERES system allows unique topographical analysis & surface modification capabilities:

  • Location of 2D/2.5D features as little as 200 nm in height

  • 3D printing metal microconnectors between contact pads and traces with  <1 µm precision

  • 3D printing metal 3D microstructures and 2D lines

  • Local dispensing of isolation or conductive layers

  • Modification of the surface with novel materials


CERES presents a unique method of modifying surface structures directly on a die, with submicrometer precision. 

Our topographical analysis function, which we term "surface mapping", is detailed in a whitepaper, available to download below:


Semiconductor dies on a wafer

Explore more micro AM use cases: Fundamental Research

Discover the myriad of research possibilities using CERES