Semiconductor Modification

Additive micromanufacturing provides new possibilities to support traditional lithographic processes for research and industrial applications. It has the capacity to modify lines and traces and chip surfaces very locally, and with pinpoint accuracy.

Our CERES system allows the selection of exact positions, and to execute prints locally. It can generate metal 3D microstructures and 2D lines, as well as enabling the local dispensing of isolation or conductive layers, and the modification of the surface with novel materials. 

CERES presents a unique method of modifying surface structures directly on a die.

Semiconductor dies on a wafer

Explore more micro AM use cases: Fundamental Research

Discover the myriad of research possibilities using CERES