3D Printing Brain-Machine Interfaces with Exaddon µAM

A 500 µm height microneedle array 3D printed with the CERES system.

Key CERES features:

  • Object size: <1 µm to 1000 µm

  • Resolution (min. feature size):  <1 µm

  • Print pure metals: Cu, Au, Ni, Ag, Pt

  • Print at room temperature

  • No post-processing required

  • Print overhanging parts without support structures

An emerging discipline combining neuroscience and biomedical engineering, neuroprosthetics (often referred to as brain-machine or  brain-computer  interfaces, neural interfaces, or cortical implants) involves connecting external computing power to the brain via electrodes or implants in order to assist or replace human brain functionality, or simply to monitor brain activity.

Through the placement of an electrode sensor on the brain, these brain-machine interfaces enable functions which are no longer possible by the human body. An increasing number of highly innovative companies are improving the lives of people suffering from hugely disempowering conditions such as Parkinson's or Alzheimer's, through use of implantable devices which are linked to external computers. 

These devices require tiny electrodes  to be implanted into the brain, and this presents challenges. Exaddon's CERES  µAM print system can  3D print microscale electrodes and electrode arrays with high conductivity in geometries impossible for any other technology, making it an ideal solution for teams researching BCIs.

CERES works through incredibly precise electrochemical deposition of ionic metals on different substrates, including flexible polymers like PEDOT:PSS. These offer great potential in neuroprosthetic applications such as brain-computer interfaces. 

Exaddon’s unique additive micromanufacturing technology  allows printing of micropillars in high-conductivity, pure metal, such as copper or gold. With object diameters possible below 1 µm, the CERES µAM print system is well-suited to creating complex and tiny structures necessary for conductive, mechanically stable electrodes. 

Explore more micro AM use cases: Semiconductor Modification

Modification and repair of semiconductor surface structures