MATERIAL PROPERTIES of µAM  

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Conductivity, Density, & Strength

Extensive testing with our research partners at EMPA, MPIE, Alemnis, and others has proven the excellent material properties of Exaddon printed metal objects. 

Key Figures: 

• Density of 3D printed microcrystalline copper: >99%
• Resistivity of copper structures: 19 ± 2 nΩ·m  
• • Around 87% of the conductivity of bulk copper
• Resistivity of gold structures: 65 ± 6 nΩ·m 
• • Excellent in the context of gold electrodeposition
• Yield strength (copper): 0.4 to 1.0 GPa
• Tensile strength (copper): 342.5 MPa

• Coating copper with nickel shells: Research with EMPA found an exceptional ~3x strength increase through coating Exaddon copper microstructures with nickel shells just 250 nm thick (compared to pure Cu). 

Read more about Exaddon material properties testing:
 

Exaddon Whitepaper - Material Properties Testing 

Substrate Adhesion and Elasticity

We printed a microscale copper spring to test the substrate adhesion and mechanical hysteresis of our printed objects:

• The copper is mechanically stable
  
• The copper behaves elastically
• There is a good adhesion to the substrate