Open Defect Repair
Increasing yield in chip production is one of the most persistent goals for microchip manufacturers. Damaged dies and failure rate during production leads to function and performance testing of the microchips and dies at the end of the production process. In most cases, underperforming or damaged dies are sorted and scrapped.
With the CERES system, specifically with the µAM technology, open defects can be repaired directly on a die. High-precision resonant circuits can be leveled by adding connecting lines between different chip areas.
The unique µAM post process in the traditional chip manufacturing increases the yield of the production and improves the quality of the individual dies.