Semiconductor Open Defect Repair

Increasing yield in semiconductor chip production is one of the most persistent goals for microchip manufacturers.

Damaged dies and the failure rate during production has resulted in function and performance testing of the microchips and dies at the end of the production process. In most cases, underperforming or damaged dies are sorted and scrapped. 

With the unique µAM capacity of our CERES system, semiconductor open defect repair is possible, directly on a die - impossible for any other technology. High-precision resonant circuits can be leveled by adding connecting lines between different chip areas. 

The unique µAM post process in traditional chip manufacturing increases the yield of the production and improves the quality of the individual dies. 

Through adjustment of the electrochemical parameters of our CERES print system, the morphology of printed structures can be controlled. All of this is conducted at room temperature, ensuring that existing structures and components are not damaged.

Single semiconductor die

Explore more micro AM use cases: High Frequency Technologies

HF Technologies for communication networks