Smarter Contact. Reliable Data.

Ultra-low leakage probe cards with 3D printed probes, for stable, repeatable
parametric and wafer acceptance testing

Probe what's next. Today.

Exaddon parametric probe cards leverage ultra-low leakage,
precision micro-3D-printed probes, and modular design to
deliver reliable measurements and protect wafer integrity
 

Advanced parametric testing places increasing demands on probe cards as pads shrink in size, leakage requirements tighten, and wafer layouts become more complex. Stable electrical contact and measurement fidelity are critical for accurate process monitoring.

Exaddon’s WAT probe cards leverage metal micro-3D printed probes to achieve controlled contact force and stable electrical performance measurements. Probe geometries can be adapted to reach pads in deep trenches and application-specific layouts.

For high-frequency and sensitive measurements, coax-shielded probing concepts help preserve signal integrity. Modular probe heads enable fast replacement and higher uptime, supporting reliable parametric data collection with lower cost of ownership.



 

Parametric Probe Card: Enabling
reliable parametric and wafer
acceptance testing


We add value by providing precision probing across shrinking pads and generating more real-estate for transistors. Exaddon’s micro-3D printed probes provide controlled contact behavior and geometry tailored to deep trench structures and sensitive parametric measurements, enabling reliable data collection across wafers and process iterations.


Ultra-low background leakage (< 1 fA/V)

Trustworthy parametric
data

Ultrafine pitch 
(<20 µm)

Pushes the limits
of miniaturization

Rapid customization through 3D printing

Adapts to diverse device designs

Modular design, replaced in minutes

Reduces downtime and
repair delays

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Talk to our experts

Ready to advance your wafer
acceptance testing?

Contact us