Smarter Contact. Higher Yield.

Probe cards with micro-3D printed probes for precise and reliable
electroluminescence (EL) testing of next-generation display technology.
Probe what's next. Today.

Exaddon microLED probe cards remove testing as a bottleneck 

MicroLED wafer testing requires contacting millions of fragile devices at fine pitch, and conventional probing is either slow, damaging the pads, or struggles to scale to fine pitches with consistent accuracy.

Exaddon’s microLED probe cards with metal micro-3D printed probes address these challenges by enabling multi-parallel testing with ultra-low contact force and sub-20µm pitch capability. This allows fast EL testing while minimizing pad damage and supporting reliable wafer-level characterization. Rapid 3D-printed probe customization supports evolving test layouts, while modular, swap-in probe heads reduce downtime and simplify maintenance.

The result is faster wafer-level testing, protected microLED pads, and higher yield at lower cost of ownership.


 

MicroLED Probe Card:
Enabling efficient & reliable electroluminescence (EL) testing of next-generation display technology


We offer highly precise probe cards with micro-3D printed probes, validated by independent partners and pilot customers for wafer-level electroluminescence (EL) testing, delivering performance beyond conventional probe technologies.

Our customizable, modular probe cards boost test efficiency, maximize yield, and increase
throughput, accelerating production while delivering consistent results beyond the limits of
conventional testing.

Multi-parallel
testing

Overcome slow
 test cycles

Low contact
force

Prevents microLED
damage

Ultrafine pitch 
(<20 µm)

Pushes the limits
of miniaturization

Rapid customization through 3D printing

Adapts to diverse device
designs

Modular design, replaced in minutes

Reduced downtime and
repair delays

​​​​

From wafer to yield: fast, precise, protected
Turn wafers into insights - efficiently and reliably


Designed for advanced microLED layouts

The following parameters indicate typical microLED designs supported by Exaddon's micro-3D printed probe technology. 
Final specifications are configurable per application.

Pad pitch >10µm
Device pitch >50µm (non-skip configuration)
Pad height variation <30 µm
Pad geometry Flat (recommended)
Wafer warpage <1 µm / 1mm (recommended)
Wafer material Transparent

MicroLED probe head specifications

All parameters are interdependent. They are customizable per customer requirements.

Probe positioning accuracy (x, y) ±2µm
Probe pitch (x) > 10µm
Probe z - planarity ±2µm
Scrub mark depth <100nm
Scrub mark length 5µm
Tip length 10µm-200µm
Probe count 2 - 512
Probe shape (can be fully customized) cantilever
Reliable electrical contact @ (OD) 12µm
Touchdowns (lifetime) >1 million

Consult an expert​​​​


Validated in real-world test environments


Talk to our experts

Ready to advance your microLED testing?

Contact us