Proprietary metal micro-3D printing technology
beyond conventional approaches
Exaddon’s proprietary metal micro-3D printing technology enables free-form geometries with unmatched precision, powering advanced probe manufacturing for wafer testing as device geometries continue to shrink.
As devices continue to shrink and structures grow more delicate, conventional probes and test layout requirements are increasingly becoming the limiting factor for chip design, cost efficiency, and test reliability. Our metal micro-3D printing process enables the fabrication of microstructures and probe geometries beyond the constraints of conventional additive or subtractive methods. This foundation gives us control over geometry, compliance, and contact characteristics that are critical for advanced wafer testing.
CERES system: the foundation of our micro-3D printing capability
Originally developed for advanced research, the CERES system established Exaddon’s core micro-3D printing expertise and continues to underpin our probe manufacturing today.
Our manufacturing competence combines proprietary hardware, advanced process control, materials science expertise, and in-house process validation to produce microstructures with high precision and repeatability. By integrating design rules with production workflows, we deliver reliable performance that can be consistently reproduced across development cycles.
Built on over 8+ years of research and proprietary process development, Exaddon’s technology is protected through a combination of patents, confidential process know-how, tightly controlled manufacturing parameters, and unique engineering expertise. Evaluations with semiconductor partners demonstrate reliable performance in conditions where traditional probe technologies struggle.
When shrinking geometries demand a new testing solution
From manufacturing breakthrough to real-world testing impact
This foundational technology underpins probe card solutions for microLED, WAT/parametric testing, and
custom high-precision applications, each addressing specific test challenges with geometry and contact
performance beyond legacy methods.


