Smarter Contact. Higher Yield.
Probe cards with micro-3D printed probe for advanced wafer testing
Probe what's next. Today.
Our probe cards are engineered to enable efficient
wafer testing,
where conventional probes reach their limits
As devices shrink and complexity increase, conventional
probe technologies struggle with
alignment,
compliance, and durability, limiting yield, throughput, and innovation.
Exaddon's probe cards address these challenges using micro-3D printed probes that
deliver precision,
reliability, and scalable performance.
Maximized testing
efficiency
Multi-parallel
probes
Non-destructive testing
Safe for
fragile
pads
Rapid
customization
Adapts to any
test layout
Seamless
integration
Works with
existing
probers and
testers
Reduced
downtime & CoO
Replaceable
probe heads
Products
MicroLED Probe Card:
Enabling efficient & reliable electroluminescence (EL)
testing of next-generation display technology
We offer highly precise probe cards with micro-3D printed probes, validated by independent partners and pilot customers for wafer-level electroluminescence (EL) testing, delivering performance beyond conventional probe technologies.
testing
Overcome slow
test cycles
force
Prevents microLED damage
(<20 µm)
Tests state-of-the-art microLED size
Adapts to any test layout
Increases uptime and reduces CoO
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Parametric Probe Card:
Enabling reliable parametric and wafer acceptance testing
We add value by providing precision probing across shrinking pads and generating more real-estate for transistors. Exaddon’s micro-3D printed probes provide controlled contact behavior and geometry tailored to deep trench structures and sensitive parametric measurements, enabling reliable data collection across wafers and process iterations.
Trustworthy parametric data
Ultrafine pitch
(<20 µm)
Pushes the limits of miniaturization
Adapts to diverse device designs
Reduces downtime and repair delays
Learn
more
Developed in close
collaboration
Custom solutions are developed in close collaboration with our customers, from initial feasibility assessment to prototype evaluation. This iterative approach ensures technical alignment, realistic performance targets, and efficient development cycles.
manufacturing
Evaluation and optimization
Tailored probe card ready for testing
Learn
more
Discover how Exaddon can help you test beyond today's limits
From ultra-fine pitch probing and ultra-low leakage
parametrics to deep-trench contact and coax-shielded high-RF
measurements, across a
range of advanced wafer-level test needs.
Validated in real-world test environments
Our technology
Proprietary metal micro-3D printing
applied to wafer
testing
Exaddon's probe cards are enabled by a proprietary
metal
micro-3D printing process, developed through years
of research and industrial validation, that allows probe
geometries and performance characteristics beyond what
conventional
manufacturing can achieve.
Learn more
News
Visit us at SWTest 2026
Exaddon at SWTest Carlsbad
2026, June 8-10
Meet Exaddon at the SWTest Conference in Carlsbad
and discover advanced probing solutions powered by micro-3D printed probes. Learn how our technology enables higher precision, performance, and yield in next-generation semiconductor testing.
Learn more
About us
Probe what's next. Today.
Born from Swiss innovation, Exaddon is redefining precision testing at the edge of physics, empowering the semiconductor and microLED industries to probe what's next, today.
Our customizable, modular probe cards improve test
efficiency, yield, and throughput, accelerating production and achieving consistent
results beyond today's testing limits.
Learn more