Exaddon AG exhibited at the SWTest Conference, which took place June 8–10, 2026, in Carlsbad, California. The event brought together leading companies and experts in semiconductor wafer test technologies.
Industry evolution & key takeaways
One takeaway from SWTest stood out: the discussion is no longer about whether devices will continue to shrink. It's about how probing can keep up.
As pad pitches drop below 30 µm, the industry faces a growing challenge: maintaining reliable electrical contact without compromising yield, throughput, or device integrity. At Exaddon, we're developing micro-3D-printed probes for ultra-fine pitch applications to help address this bottleneck and expand what's possible in wafer-level testing.
Podium presentation & fruitful discussions
A fruitful discussion followed the presentation by Dr. Francesco Colangelo, our Head of Products, reinforcing the inevitability of ultra-fine pitch testing solutions as the semiconductor industry moves toward smaller geometries. Visitors who connected with our experts discovered how micro-3D-printed probe arrays are advancing semiconductor testing, gaining the opportunity to:
- Learn about micro-3D printed probe technology.
- Explore applications for advanced semiconductor testing.
- Discuss custom probing solutions with Exaddon specialists.
Exaddon at SWTest Carlsbad 2026